数据中心 optical communications
Optical communication uses light, rather than electrical signals, to carry information across fiber optics networks. The unprecedented growth in the flow of data crossing these networks is stressing them like never before.
Optical communications 解决方案 from GlobalFoundries® (GF®) enable more data to enter and exit these networks, resulting in dramatic capacity increases.
Optical communications 解决方案 from GF
High performance silicon photonics O-band optical components, including 25 Gbaud MZM with passive fiber attach.
Superior silicon photonics optical components with O-band and C-band capability, including 50 Gbaud MZM PAM-4. Features on-chip laser attach and Freeform design enablement.
High-performance SiGe 解决方案 for data center transimpedance amplifiers and drivers.
数据中心 optical transceivers using 90WG and 90WG+ silicon photonics
Silicon photonics (SiPh) uses optical I/O for rapid transmission of data to supercharge data center fiber optic networks while minimizing signal loss and degradation.
GlobalFoundries® (GF®) helps designers harness the power of light for 100G+ optical transceiver applications with 90WG and 90WG+ SiPh semiconductor 解决方案. These 解决方案 enable you to integrate RF, digital elements and silicon photonics circuits on the same chip and benefit from the scale, efficiencies and process controls of 300 mm silicon manufacturing.
High-volume 300 mm CMOS manufacturing offers supply assurance and enables you to take advantage of advanced processing and controls for mainstream photonic integrated circuit (PIC) deployment in hyper-scale data center interconnects.
The monolithic integration capabilities of GF’s 90WG and 90WG+ 解决方案 offer power, area and performance advantages for cost-effective designs that deliver more data per watt per fiber per laser.
90WG and 90WG+ are optimized to help you meet high-speed (100G and beyond) optical connectivity demands by offering a 40 GHz germanium photodiode paired with 25 Gbaud and 50 Gbaud Mach-Zehnder modulators, 分别.
数据中心 TIAs and drivers using 锗硅9惠普和8XP
Current and emerging performance-driven data center applications require low power/ high-frequency transimpedance (TIA) and linear driver performance. High-performance silicon germanium (SiGe) 解决方案 from GlobalFoundries® (GF®) are designed to deliver the speed, performance and bandwidth that optical chips for next-generation, performance-optimized hardware require. 锗硅9惠普和8XP, built on 90 nm and 130 nm SiGe BiCMOS platforms 分别, enable you to integrate extensive digital and RF functionality and exploit silicon economies of scale.
锗硅9惠普和8XP feature advanced heterojunction bipolar transistors (HBTs) that enable operation at high junction temperatures, while delivering superior low-noise and high-frequency performance (370 GHz and 340 GHz f马克斯分别).
GF SiGe PDKs leverage our experts’ decades of experience with SiGe 解决方案—some of the original scientists and engineers who pioneered SiGe. The kits provide RF-specific tool support along with best-in-class model-to-hardware correlation accuracy.
SiGe 解决方案 are complemented by end-to-end design enablement, 原型设计服务, the RFwave™ and superior factory capabilities so designers can meet design and performance goals, easily inject differentiation and bring products to market faster.
Connectivity of everything, everywhere requires technology that scales with performance and cost. Rapidly increasing volumes of data require wireless, wireline and networking processing infrastructure that enable the highest performance levels in the cloud and ultra-low power at the edge.
GlobalFoundries® (GF®) end-to-end portfolio of 解决方案 span your infrastructure needs, 交付敏捷, efficient edge-to-cloud performance.